The STM32F401xB/STM32F401xC devices are based on the high-performance Arm? Cortex? -M4 32-bit RISC core operating at a frequency of up to 84 MHz. The Cortex?-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security. The STM32F401xB/STM32F401xC incorporate high-speed embedded memories (up to 256 Kbytes of Flash memory, up to 64 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.

All devices offer one 12-bit ADC, a low-power RTC, six general-purpose 16-bit timers including one PWM timer for motor control, two general-purpose 32-bit timers. They also feature standard and advanced communication interfaces.

The STM32F401xB/STM32F401xC operate in the - 40 to + 125 °C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.

These features make the STM32F401xB/STM32F401xC microcontrollers suitable for a wide range of applications.

All features

Dynamic efficiency line with BAM (batch acquisition mode)

1.7 V to 3.6 V power supply

-40 °C to 85/105/125 °C temperature range

Core: Arm? 32-bit Cortex?-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator?) allowing 0-wait state execution from Flash memory, frequency up to 84 MHz, memory protection unit, 105 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions

Memories

Up to 256 Kbytes of Flash memory

512 bytes of OTP memory

Up to 64 Kbytes of SRAM

Clock, reset and supply management

1.7 V to 3.6 V application supply and I/Os

POR, PDR, PVD and BOR

4-to-26 MHz crystal oscillator

Internal 16 MHz factory-trimmed RC

32 kHz oscillator for RTC with calibration

Internal 32 kHz RC with calibration

Power consumption

Run: 128 μA/MHz (peripheral off)

Stop (Flash in Stop mode, fast wakeup time): 42 μA typ @ 25 °C;65 μA max @25 °C

Stop (Flash in Deep power down mode, slow wakeup time): down to 10 μA typ@ 25 °C; 28 μA max @25 °C

Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V

VBAT supply for RTC: 1 μA @25 °C

1×12-bit, 2.4 MSPS A/D converter: up to 16 channels

General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support

Up to 11 timers: up to six 16-bit, two 32-bit timers up to 84 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer

Debug mode

Serial wire debug (SWD) & JTAG interfaces

Cortex?-M4 Embedded Trace Macrocell?

Up to 81 I/O ports with interrupt capability

All IO ports 5 V tolerant

Up to 78 fast I/Os up to 42 MHz

Up to 11 communication interfaces

Up to 3 × I2C interfaces (1Mbit/s, SMBus/PMBus)

Up to 3 USARTs (2 x 10.5 Mbit/s, 1 x 5.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)

Up to 4 SPIs (up to 42 Mbits/s at fCPU= 84 MHz), SPI2 and SPI3 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock

SDIO interface

Advanced connectivity

USB 2.0 full-speed device/host/OTG controller with on-chip PHY

CRC calculation unit

96-bit unique ID

RTC: subsecond accuracy, hardware calendar

All packages are ECOPACK2