The STM32F410x8/B devices are based on the high-performance ARM?Cortex? -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex?-M4 core features a Floating point unit (FPU) single precision which supports all ARM single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security. The STM32F410x8/B belong to the STM32 Dynamic Efficiency? product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing to save even more power consumption during data batching. The STM32F410x8/B incorporate high-speed embedded memories (up to 128 Kbytes of Flash memory, 32 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, one AHB bus and a 32-bit multi-AHB bus matrix. All devices offer one 12-bit ADC, one 12-bit DAC, a low-power RTC, three general-purpose 16-bit timers, one PWM timer for motor control, one general-purpose 32-bit timers and one 16-bit low-power timer. They also feature standard and advanced communication interfaces.
All features
Dynamic Efficiency Line with BAM (Batch Acquisition Mode)
Core: ARM?32-bit Cortex?-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator?) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
Memories
Up to 128 Kbytes of Flash memory
512 bytes of OTP memory
32 Kbytes of SRAM
Clock, reset and supply management
1.7 V to 3.6 V application supply and I/Os
POR, PDR, PVD and BOR
4-to-26 MHz crystal oscillator
Internal 16 MHz factory-trimmed RC
32 kHz oscillator for RTC with calibration
Internal 32 kHz RC with calibration
Power consumption
Run: 89 μA/MHz (peripheral off)
Stop (Flash in Stop mode, fast wakeup time): 40 μA Typ @ 25 °C; 49 μA max @25 °C
Stop (Flash in Deep power down mode, fast wakeup time): down to 6 μA @ 25 °C; 14 μA max @25 °C
Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V
VBATsupply for RTC: 1 μA @25 °C
1×12-bit, 2.4 MSPS ADC: up to 16 channels
1×12-bit D/A converter
General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
Up to 9 timers
One 16-bit advanced motor-control timer
One low-power timer (available in Stop mode)
Three 16-bit general purpose timers
One 32-bit timer up to 100 MHz with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
Two watchdog timers (independent window)
SysTick timer.
Debug mode
Serial wire debug (SWD) & JTAG interfaces
Cortex?-M4 Embedded Trace Macrocell?
Up to 50 I/O ports with interrupt capability
Up to 45 fast I/Os up to 100 MHz
Up to 49 5 V-tolerant I/Os
Up to 9 communication interfaces
Up to 3x I2C interfaces (SMBus/PMBus) including 1x I2C Fast-mode at 1 MHz
Up to 3 USARTs (2 x 12.5 Mbit/s, 1 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
Up to 3 SPI/I2Ss (up to 50 Mbit/s SPI or I2S audio protocol)
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