The STM32F401xB/STM32F401xC devices are based on the high-performance Arm? Cortex? -M4 32-bit RISC core operating at a frequency of up to 84 MHz. The Cortex?-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security. The STM32F401xB/STM32F401xC incorporate high-speed embedded memories (up to 256 Kbytes of Flash memory, up to 64 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix. All devices offer one 12-bit ADC, a low-power RTC, six general-purpose 16-bit timers including one PWM timer for motor control, two general-purpose 32-bit timers. They also feature standard and advanced communication interfaces. The STM32F401xB/STM32F401xC operate in the - 40 to + 125 °C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications. These features make the STM32F401xB/STM32F401xC microcontrollers suitable for a wide range of applications.
All features
Dynamic efficiency line with BAM (batch acquisition mode)
1.7 V to 3.6 V power supply
-40 °C to 85/105/125 °C temperature range
Core: Arm? 32-bit Cortex?-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator?) allowing 0-wait state execution from Flash memory, frequency up to 84 MHz, memory protection unit, 105 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
Memories
Up to 256 Kbytes of Flash memory
512 bytes of OTP memory
Up to 64 Kbytes of SRAM
Clock, reset and supply management
1.7 V to 3.6 V application supply and I/Os
POR, PDR, PVD and BOR
4-to-26 MHz crystal oscillator
Internal 16 MHz factory-trimmed RC
32 kHz oscillator for RTC with calibration
Internal 32 kHz RC with calibration
Power consumption
Run: 128 μA/MHz (peripheral off)
Stop (Flash in Stop mode, fast wakeup time): 42 μA typ @ 25 °C;65 μA max @25 °C
Stop (Flash in Deep power down mode, slow wakeup time): down to 10 μA typ@ 25 °C; 28 μA max @25 °C
Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V
VBAT supply for RTC: 1 μA @25 °C
1×12-bit, 2.4 MSPS A/D converter: up to 16 channels
General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
Up to 11 timers: up to six 16-bit, two 32-bit timers up to 84 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer
Debug mode
Serial wire debug (SWD) & JTAG interfaces
Cortex?-M4 Embedded Trace Macrocell?
Up to 81 I/O ports with interrupt capability
All IO ports 5 V tolerant
Up to 78 fast I/Os up to 42 MHz
Up to 11 communication interfaces
Up to 3 × I2C interfaces (1Mbit/s, SMBus/PMBus)
Up to 3 USARTs (2 x 10.5 Mbit/s, 1 x 5.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
Up to 4 SPIs (up to 42 Mbits/s at fCPU= 84 MHz), SPI2 and SPI3 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock
SDIO interface
Advanced connectivity
USB 2.0 full-speed device/host/OTG controller with on-chip PHY